1 of 6

2uul 5 in 1 DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades

SKU: EDA0084304
Sale Sold out Pre-order
Regular price R 209.00
Regular price Sale price R 209.00
Pay in 3, 6, or 12 monthly instalments with

Import Taxes & Duties Included

6-13 business days

In Stock CHN

Processing time: 1-3 days

Description

The 2uul 5 in 1 DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades are designed for precise removal of underfill glue and solder pads. Technicians can efficiently cut through tough underfill glue around IC chips during motherboard rework.

  • Type: Solder removal blades
  • Function: Flat cutting for underfill glue and solder pad removal
  • Material: High-hardness stainless steel
  • Wear resistance: Excellent
  • Compatibility: Fully compatible with 2UUL blade handle systems
  • Application: Ideal for BGA, CPU, NAND, and micro soldering tasks
  • Design: Ultra-thin blade tip for reaching narrow gaps under chips
  • Use case: Suitable for high-density PCB boards
  • Efficiency: Improves repair efficiency during motherboard rework

Questions about features, compatibility, or warranty? Chat with our local support team!