AMAOE 0.12mm Reballing Stencil For WiFi Comprehensive

SKU: EDA008186206
Sale Sold out Pre-order
Regular price R 249.00
Regular price Sale price R 249.00
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Description

AMAOE 0.12mm Reballing Stencil is a BGA stencil designed for high-precision IC chip repairs. It is suitable for Apple chip models, enhancing reballing success rates and ensuring optimal performance.

  • Product Type: BGA Stencils
  • Compatibility: Apple chip models (CPUs, basebands, power management ICs, and other common chips)
  • Material: Stainless steel
  • Design: Ultra-thin, 0.12mm
  • Heat Resistance: Excellent
  • Corrosion Resistance: Excellent
  • Durability: Highly durable and wear-resistant
  • Reuse Cycles: Capable of withstanding hundreds of reuse cycles under normal conditions
  • Cutting Technology: Laser micron-level cutting technology
  • Aperture Sizes: Uniform
  • Solder Ball Alignment: Highly accurate
  • Operation: Quick and easy with precisely aligned hole positions
  • Efficiency: Improves reballing efficiency and reduces rework rates
  • Application: Suitable for individual technicians and professional mass production environments
  • Maintenance: Easy to clean
  • Cost-Effectiveness: Lowers repair costs

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