EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket Burning Socket for Data Recovery Mobile Phone Repair
EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket Burning Socket for Data Recovery Mobile Phone Repair
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R623.76/mo 3 months
- R315.41/mo 6 months
- R166.46/mo 12 months
- From R623.76/month over 3 months, or as low as R166.46/month over 12. Total repayable over 12 months: R1997.52. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
Continue to checkoutDon't have Mobicred yet? Apply free — takes about 2 minutes →
Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
In Stock CHN
Processing time: 1-3 days
Couldn't load pickup availability
Description
EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket is a test block designed for integrated circuit (IC) testing. It is used in mobile phone repair to facilitate data recovery by connecting ICs to a computer via an SD interface.
- Type: Test block
- Interface type: SD
- Application: Integrated circuit (IC)
- Test method:
- Select the limit frame that matches the IC and place the IC flat in the socket according to the direction.
- Insert the SD interface into the card reader and connect to the computer, selecting the corresponding test program.
- Compatibility:
- Compatible with 169-FBGA and 153-FBGA ICs
- Materials:
- Shrapnel made of imported beryllium copper with high-precision die stamping
- Gold plating on hardened and thickened head shape for stability and durability
- Features:
- Compatible with ball and no ball test; IC limit frame can be replaced
- Overall structure of contact module reduces repeated positioning issues
- High pass rate in one test due to accurate alignment with IC PAD
- Welding structure ensures good contact and stable testing
- Flip cover structure for convenient manual testing
- Mold integral molding and spring self-adaptive structure for ICs of varying thickness (0.6-2.0MM)
- Injection molding for precise positioning and higher work efficiency
- Repair and maintenance:
- Use an air gun or anti-static brush to remove impurities from the socket seat
- Clean the socket with absolute alcohol to remove impurities from the shrapnel
- Replace shrapnel if burned or broken
- Ensure USB interface is not plugged in during detection
- Avoid cleaning with organic solvents to prevent damage
- Seal with an anti-static bag when not in use for extended periods
PMC TechLife is an independent retailer. Any third-party trademarks or brand names mentioned are the property of their respective owners and are used strictly to indicate product compatibility.
Questions about features, compatibility, or warranty? Chat with our local support team!
